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Document No.:
Approval Product Specification
Module name: C0201QILK-C Issue date: 2009/01/06 Version: 1.1
Customer Approved by Customer
Approved by CMEL
PD Division ENG Division QA Dept
FOR MORE INFORMATION: AZ DISPLAYS, INC. 75 COLUMBIA, ALISO VIEJO, CA 92656 Http://www.AZDISPLAYS.com
Note:
1. The information contained herein may be change without prior notice. It is therefore advisable to contact Chi MEI ELCorp before designed your product based on this specification.
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Reversion History Version P-Ver.1.0 P-Ver.1.1 P-Ver.1.2 Date 2008/03/11 2008/03/12 2008/06/04 Page All Page17 Page3 Page17 Page18 Page19 Page12 Page13 Page12 Page19 All Page2 Description Preliminary specification was first issued Modify the connector in the drawing Modify the pixel pitch size Modify the Panel drawing Add Reliability Test Add the Package drawing Modify Electro-Optical Characteristic table Modify Gamma Register Setting Modify IC Initial Register Setting Add RA condition Modify Low Temp. Operation Approval specification was first issued Modify Electro-Optical Characteristic table Add Preliminary specification reversion history
P-Ver1.3 P-Ver1.4 P-Ver1.5 A-Ver.10 A-Ver1.1
2008/06/19 2008/06/20 2008/06/24 2008/12/03 2009/01/06
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1. Purpose: This documentation defines general product specification for OLED module supplied by CMEL. The information described in this technical specification is tentative. Please Contact CMEL's representative while your product is modified. 2. General Description: Driving Mode: Active Matrix. Color Mode: Full Color (262K color) Driver IC: S6E63D6, COG Assembly Interface: 1. MPU i80-system 18-/16-/9-/8-bit bus interface 2. MPU i68-system 18-/16-/9-/8-bit bus interface 3. Serial data transfer interface(SPI) Application: Cell phone etc.. RoHS Compatible 3. Mechanical Data: No. 1 2 3 4 5 6 7 Items Diagonal Size Resolution Pixel Pitch Active Area Outline Area(M/F) Thickness Weight Specification 2.0" 176 xRGBx220 0.18x0.18 31.68x39.6 37.3x50.25 1.60 (Typ) 9.2 Unit Inch mm mm mm mm g
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Document No.: 4. Absolute Maximum ratings: 4.1 Absolute ratings of environment Item Storage Temperature Operating Ambient Temperature Symbol TST TOP Value Min. -40 -40 Max. +85 +70 Unit C C Note (1) (2)
Note (1) The storage duration for both critical temperature (-40 & 85) meet reliability test criteria of product . (2) The operating duration for both critical temperature (-40 & 70) meet reliability test criteria of product.
4.2 Electrical absolute ratings Item Power supply voltage 1 Power supply voltage 2 Power supply voltage 3 Power supply voltage 4 Symbol AR_Vdd AR_Vss VCI VDD3 (IOVcc) Unit V V V V Value +4.6V +/- 0.05 -4.4V +/- 0.1 +2.5 ~ +3.3 +1.65 ~ +3.3
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Document No.: 5. Electrical Characteristic: 5.1 DC Characteristic
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Document No.:
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Document No.: 5.2 AC Characteristic 5.2.1 CPU interface M68
(VDD3=1.65 to 3.3V,TA=-40 to +85C)
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Document No.: 5.2.2 CPU interface M80
(VDD3=1.65 to 3.3V,TA=-40 to +85C)
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Document No.: Image Data format for 18bit CPU interface (262k color)
Image Data format for 16bit CPU interface (65k color)
Image Data format for 9bit CPU interface (262k color)
Image Data format for 8bit CPU interface (65K color) Case 1:
Case 2:
Image Data format for 8bit CPU interface (262K color)
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Document No.: 5.2.3 SPI
(VDD3=1.65 to 3.3V,TA=-40 to +85C)
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Document No.:
ID RS RW
ID RS AW
(Note) RS="0" : Index data RS="1" : Parameter data
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Document No.: 6. Electro-Optical Characteristic: Items Operating Luminance Power Consumption Max. Current Response Time CIEx (White) CIEy( White) CIEx (Red) CIEy( Red) CIEx (Green) CIEy( Green) CIEx (Blue) CIEy( Blue) Viewing Angle Contrast Operation Lifetime Note:
Measuring surrounding: dark room Surrounding temperature: 25oC
IOVCC = 1.65V ~ 3.3V
Symbol L Pon Icc Tres Wx Wy Rx Ry Gx Gy Bx By VA CR LTop
Min 150 0.26 0.28 0.62 0.30 0.25 0.62 0.11 0.12 160 5000:1 30000
Typ. 190 170 0.31 0.33 0.66 0.34 0.29 0.66 0.15 0.16 170 10000:1
Max 230 233 78 50 0.36 0.38 0.70 0.38 0.33 0.70 0.19 0.20 -
Unit Cd/m mW mA us 2
Remark (1)(5) 30% pixels on (1) (1) (2) (5) (5) (5) (5) (5) (5) (5) (5)
Degree Hrs
(3) (4) (1)(6)
1. Test condition:
a. AR_VDD= 4.6V+/- 0.03V, AR_VSS= -4.4V+/- 0.03V b. IC Initial Register Setting: R01: R02: R03: R10: R18: RF8: RF9: R05: R35: R36: R37: R20: R21: 0x881C 0x0000 0x0030 // 16bit mode 0x0000 // IC stand by off 0x0028 // Frame Rate=80Hz 0x000F // VGH=+5V 0x0019 // VGL=-7V 0x0001 // Display On 0x0000 // window display 0x00DB 0x20CF // window display // window display // Set scan line
0x0020 // window display 0x0000 // window display
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Gamma Register Setting: Gamma Setting CodeB R70: R71: R72: R73: R74: R75: R76: R77: R78: 0x3300 0x3900 0x3800 0x2924 0x261C 0x3125 0x271C 0x352A 0x2A1E
2.Response Time test condition
Tr
100% 90%
Tf
10%
Time
3.Viewing angle test condition:
Viewing Angle= CR>10 4.Contrast
Luminance with all pixels white CR = Luminance with all pixels black
5.Optical tester: CA210 6. Brightness of 30% power consumption. Operating Life Time is defined when the luminance
has decayed to less than 50% of the initial measured luminance before life test.
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Document No.: 7. System Diagram:
HOST
S6E63D6
SPI interface
CSB SDIN RW_WRB(SCL)
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Document No.: 8. Pin Assignment: PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 Symbol AR_VDD AR_VSS VCI VCI1 GND C12M C12P C11M C11P VLOUT1 C31P C31M C32P C32M VLOUT3 VLOUT2 C21P C21M FLM IOVCC SPB ID_MIB DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 I/O I I I O I I I I I O I I I I O O I I O I I I I/O I/O I/O I/O
Tearing effect output signal. In normal operation, leave this pad open. I/O power supply Select the CPU interface mode. (0=parallel interface 1=serial interface) Select the CPU type (0=intel 80x-system 1=motorola 68x-system) BI-directional data bus. When CPU I/F, 18-bit interface : DB 17-0 16-bit interface : DB 17-10 , DB 8-1 9-bit interface : DB 8-0 8-bit interface : DB 8-1 When RGB I/F 3rd booster output pin. (1u/16V) 2nd booster output pin. (1u/16V) External capacitance connect pin between C21M and C21P. (1u/10V) External capacitance connect pin between C32M and C32P (1u/10V) 1st booster output pin. (1u/10V) External capacitance connect pin between C31M and C31P (1u/10V) External capacitance connect pin between C11M and C11P (1u/10V) Positive voltage for OLED Nagative voltage for OLED Power supply for analog circuit(2.5v~3.3v) A reference voltage for 1st booster r(connect a 1u/10v capacitance to gnd) Ground External capacitance connect pin between C12M and C12P (1u/10V)
Description
Remarks
I/O 18-bit interface : DB 17-0 18-bit interface : DB 17-0 I/O I/O I/O Fix unused pin to the VSS level I/O I/O I/O
16-bit interface : DB 17-10, DB 8-1 6-bit interface : DB 8-3
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Document No.: 34 35 36 37 38 39 40 41 42 43 44 45 46 47 DB6 DB5 DB4 DB3 DB2 DB1 DB0 NC NC NC NC SDI (SDIN) SDO (SDOUT) CSB (CS/NCS) I O I
For a serial peripheral interface(SPI), input data is fetched at the rising edge of the SCL signal, Fix SDI pin at VSS level if the pin is not used. For a serial peripheral interface (SPI), serves as the serial data olutput pin(SDO), Successive bits are output at the falling edge of the SCL signal. Chip select signal input pin. 0= driver IC is selected and can be accessed. 1= driver IC is not selected and cannot be accessed. Pin function CPU type Pin description Read/Write operation RW 68-system selection pin 0=write 1=read Write strobe signal.(Input pin) WRB 80_system Data is fetched at the rising edge. SCL SPI The synchronous clock signal Register select pin. 0=Index/status, 1=instruction parameter, GRAM data Must be fixed at VDD3 level when not used. Pin Function CPU type Pin description Read/Writeoperation enable E 68-system pin Read strobe signal. RDB 80_system Read out data at the low level When SPI mode is selected , fix this pin at VDD3 levle Reset pin initializes the IC when low. Should be reset after power-on. Internal power for RAM. Connect a capacitance to gnd. Connect a capacitance(1u/10v) to gnd. A reference level for the grayscale voltage. Connect a capacitance(1u/10v) to gnd. Power supply for analog circuit(2.5v~3.3v) The positive voltage used in the gate driver. Connect a capacitance(1u/10v) to gnd. The negative voltage used in the gate driver. Connect a capacitance(1u/10v) to gnd. Ground For touch screen
I/O I/O I/O I/O I/O I/O I/O
48
RW_WRB (SCL)
I
49
RS
I
50
E_RDB
I
51 52
RESETB MVDD
I O O I O O
53 VREG1OUT 54 55 56 57 58 VCI VGH VGL GND
X-
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Document No.: 59 60 61
YX+ Y+ For touch screen For touch screen For touch screen
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Document No.: 9. Reliability Test: No. 1 2 3 4 5 6 7 Items High Temp. Storage Low Temp. Storage High Temp. Operation Low Temp. Operation High Temp / Humidity Storage High Temp / Humidity Operation Thermal shock 85C, 240hrs -40C, 240hrs 70C, 240hrs -40C, 240hrs 85C, 85%RH, 240hrs 60C, 90%RH, 240hrs -40C ~85C (-40C /30min; transit/3min; 85C /30min; transit /3min) 1cycle: 66min, 100 cycles Frequency: 5~50HZ, 0.5G Scan rate: 1 oct/min Time: 2 hrs/axis Test axis: X, Y, Z Height: Follow ISTA spec. Sequence : 1 angle3 edges and 6 faces Cycles: 1 10 ESD Test and measurement conditions All measurements shall not be started until the specimens attain to temperature stability. The degradation of Polarizer is ignored for item 1, 5 & 6. The test pattern at operating condition is 30%P.C. alternating pictures. Evaluation Criteria No damage to glass or encapsulation No drastic change to display Defects / Mura follow product specification Luminance: Within +/-50% of initial value Current consumption: within +/-50% of initial value Air discharge model, 8kV, 10 times Specification
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Vibration
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Drop
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10. Handling: 10.1 Do not scratch the surface of the polarizer film as it is easily damaged. 10.2 When cleaning the display surface, use soft cloth with solvent (as recommended below) and wipe lightly Ethyl alcohol Isopropyl alcohol 10.3 Do not wipe the display surface with dry or hard materials that damage the polarizer surface. 10.4 Since this OLED panel is made of glass, dropping the module or banging it against hard objects may cause cracks or fragmentation. 10.5 Do not disassemble the OLED module as it may cause permanent damage. 10.6 Hold OLED very carefully when placing OLED module into the system housing. Do not excessive stress or pressure to OLED module.
11. Storage 11.1 Storing in a polyethylene bag with the opening sealed. 11.2 Placing in a dark place where neither exposure to direct sunlight nor any fluorescent light is permitted and keep at room temperature & room humidity. 11.3 Storing with no contact with polarizer surface. It is recommended to store them in the inner container which we delivered.
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12. External Dimension:
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13. Package:
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